The weight of Chinese brands in global auto sales is growing by the day.

According to a compilation of automobile sales (including some estimates) in 86 countries around the world, the number of vehicles sold by Chinese brands increased by 18.0% year-on-year to 19.71 million units.
The Chinese market share (by country/region) is highest in China (64.1%), and has already expanded to over 10% in the CIS (46.4%), Africa (11.7%), and Oceania (11.1%), led by Russia. In addition, the share has been steadily increasing in the Middle East (9.2%) and Latin America (9.0%), and this trend is expected to continue for the foreseeable future.
This presentation will introduce BYD’s efforts in Japan and the addition of features to vehicles for the Japanese market, as well as the latest technologies used in some BYD Group models, including the new “Super e-platform” platform announced in March of this year and the next-generation chassis control “Di-Sus”.

The growth of the global market as a whole, including Japanese, European, U.S., and Korean automakers, has been limited to 1.6%, and it can be said that the Chinese automakers are clearly taking over the market.

Regarding the technological evolution of Bosch’s next-generation 77GHz automotive radar, the evolution of 77GHz automotive radar is required for further advancement of driver assistance technology.

The functions and performance of the next-generation radar under development are explained, and the SoC has been developed using 22nm RF CMOS technology with vertical integration.
In addition, we will introduce our efforts in AI-based object recognition and interference suppression functions.

The transition to SDV is changing the nature of business and technology.
This presentation will cover elemental technologies essential for SDV realization, such as security, sensing, communications, and E/E platforms, and will introduce evaluation equipment that contributes to solving performance, safety, and connectivity issues.

As the demand for electric power increases in various fields, the importance of power devices responsible for power conversion is growing significantly.
Focusing on technological innovations for higher efficiency, smaller size, and lower cost, we will introduce the latest technology trends from devices to circuits, including inverter and bare chip evaluation.

For example, development of compact, high power density power modules applying wide bandgap devices is accelerating for higher efficiency in inverters for EVs and power supplies for data centers.
We will show examples of the latest power device/module developments that are actively underway worldwide and introduce ultra-compact, high power density power modules with new structures developed by our team, and report on the electrical, thermal, and reliability evaluation methods and results.

Power devices are semiconductor devices installed in power electronics equipment that convert and control electric power, and play an important role in a decarbonized society and energy conservation.
In order to further improve the efficiency and miniaturization of devices and systems, technological developments are underway to adopt wide bandgap semiconductors and to improve device performance and cost reduction.

We will introduce a comprehensive development environment for power electronics circuits that combines actual measurements and simulation.
The environment includes bare chip evaluation, high-side testing using optically isolated differential probes, a double pulse tester that evaluates ns-order high-speed switching operations with high reproducibility, and a device modeling environment that utilizes actual measurement data,
In addition, we analyze circuit simulators that integrate electromagnetic field analysis and circuit analysis, etc. Please request a report.